5CGXFC5C6F27C7N vs 5AGXMA3D4F27I5G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXFC5C6F27C7N sa pamamagitan ng Intel at 5AGXMA3D4F27I5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 5CGXFC5C6F27C7N | 5AGXMA3D4F27I5G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V GX | Arria V GX |
| Logic Elements | 77,000 | — |
| Embedded Memory | 5,001,216 bits | — |
| Number of M10K Blocks | 446 | — |
| Number of MLAB Blocks | 832 | — |
| User I/O Pins | 336 | — |
| Hard Memory Controllers | 2 | — |
| Logic Array Blocks (LABs) | 4,535 | — |
| 18x18 Multipliers | 312 | — |
| PLLs (Fractional) | 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Transceiver Channels | 6 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Temperature na Operasyon | 0C to +85C (Commercial) | — |
| Packhaging | 672-FBGA (27 mm x 27 mm, 1.0 mm pitch) | 672-ball FCBGA (F27) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm |
| Series | Cyclone V | — |
| Supplier Device Package | 672-FBGA | — |
| Logic Elements (LE) | — | 156,000 |
| Embedded Memory Bits | — | 11,746,304 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| General-Purpose I/Os | — | 336 |
| Package Body Size | — | 27 x 27 mm |
| Seated Height | — | 2.7 mm |
| Transceivers | — | Integrated multi-gigabit transceivers |
| Hard IP Blocks | — | PCIe Gen2, memory controllers |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Configuration | — | JTAG, serial flash, passive parallel |