A3PE3000L-1FGG484M vs A3PE3000-FG484 तुलना
विस्तृत दोनों ओर की तुलना A3PE3000L-1FGG484M द्वारा Microchip Technology और A3PE3000-FG484 द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip
A3PE3000L-1FGG484M ✓ सक्रियMicrochip Technology
A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
A3PE3000-FG484 ✓ सक्रियविशेषता तुलना
| पैरामीटर | A3PE3000L-1FGG484M | A3PE3000-FG484 |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | ProASIC3L (Flash FPGAs with Flash*Freeze) | ProASIC3E Flash FPGA |
| System Gates | 3000000 | 3000000 |
| Logic Elements | 35K LEs | — |
| CLBs | 75264 | — |
| User I/Os | 341 | — |
| Embedded SRAM | 516096 bits (504 kbits) true dual-port | — |
| Core Voltage | 1.2 V to 1.5 V | 1.5 V |
| I/O Voltage (VCCI) | as low as 1.2 V | — |
| Process Technology | 130 nm, 7-layer metal (6 copper) flash-based CMOS | 130 nm flash CMOS |
| Speed Grade | -1 | — |
| Configuration | Non-volatile Flash, live-at-power-up, single-chip, reprogrammable | — |
| Special Features | Flash*Freeze technology | — |
| पैकेज | 484-ball FBGA (FGG484), 1 mm pitch | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| ऑपरेटिंग तापमान | [DATA_NEEDED: operating temperature range for -M suffix] | [DATA_NEEDED: operating temperature range] |
| Design Software | Microchip Libero SoC | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) |
| Logic Cells (DFEs) | — | 75264 |
| User I/O | — | 341 |
| System Frequency | — | 231 MHz |
| Configuration Memory | — | On-chip flash (non-volatile, single-chip) |
| Soft CPU Support | — | Optional soft ARM support |
| Differential I/O Standards | — | LVDS, LVPECL |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded block RAM capacity] |