A3PE3000L-1FGG484M vs A3PE3000-FG484 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FGG484M sa pamamagitan ng Microchip Technology at A3PE3000-FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
A3PE3000L-1FGG484M A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip

A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip

A3PE3000L-1FGG484M ✓ Nakahanda
Microchip Technology
A3PE3000-FG484 A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip

A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip

A3PE3000-FG484 ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro A3PE3000L-1FGG484M A3PE3000-FG484
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family ProASIC3L (Flash FPGAs with Flash*Freeze) ProASIC3E Flash FPGA
System Gates 3000000 3000000
Logic Elements 35K LEs —
CLBs 75264 —
User I/Os 341 —
Embedded SRAM 516096 bits (504 kbits) true dual-port —
Core Voltage 1.2 V to 1.5 V 1.5 V
I/O Voltage (VCCI) as low as 1.2 V —
Process Technology 130 nm, 7-layer metal (6 copper) flash-based CMOS 130 nm flash CMOS
Speed Grade -1 —
Configuration Non-volatile Flash, live-at-power-up, single-chip, reprogrammable —
Special Features Flash*Freeze technology —
Packhaging 484-ball FBGA (FGG484), 1 mm pitch 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon [DATA_NEEDED: operating temperature range for -M suffix] [DATA_NEEDED: operating temperature range]
Design Software Microchip Libero SoC —
Tindminan RoHS [DATA_NEEDED: RoHS status] G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info)
Logic Cells (DFEs) — 75264
User I/O — 341
System Frequency — 231 MHz
Configuration Memory — On-chip flash (non-volatile, single-chip)
Soft CPU Support — Optional soft ARM support
Differential I/O Standards — LVDS, LVPECL
Footprint Compatibility — FG256 and FG484 footprint-compatible
Packaging — Tray
Embedded Memory — [DATA_NEEDED: embedded block RAM capacity]

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