A3PE3000L-1FGG484M vs A3PE3000-FG484 Perbandingan
Perbandingan bersamaan detil A3PE3000L-1FGG484M dari Microchip Technology dan A3PE3000-FG484 dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip
A3PE3000L-1FGG484M ✓ AktifMicrochip Technology
A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
A3PE3000-FG484 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | A3PE3000L-1FGG484M | A3PE3000-FG484 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3L (Flash FPGAs with Flash*Freeze) | ProASIC3E Flash FPGA |
| System Gates | 3000000 | 3000000 |
| Logic Elements | 35K LEs | — |
| CLBs | 75264 | — |
| User I/Os | 341 | — |
| Embedded SRAM | 516096 bits (504 kbits) true dual-port | — |
| Core Voltage | 1.2 V to 1.5 V | 1.5 V |
| I/O Voltage (VCCI) | as low as 1.2 V | — |
| Process Technology | 130 nm, 7-layer metal (6 copper) flash-based CMOS | 130 nm flash CMOS |
| Speed Grade | -1 | — |
| Configuration | Non-volatile Flash, live-at-power-up, single-chip, reprogrammable | — |
| Special Features | Flash*Freeze technology | — |
| Paket | 484-ball FBGA (FGG484), 1 mm pitch | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | [DATA_NEEDED: operating temperature range for -M suffix] | [DATA_NEEDED: operating temperature range] |
| Design Software | Microchip Libero SoC | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) |
| Logic Cells (DFEs) | — | 75264 |
| User I/O | — | 341 |
| System Frequency | — | 231 MHz |
| Configuration Memory | — | On-chip flash (non-volatile, single-chip) |
| Soft CPU Support | — | Optional soft ARM support |
| Differential I/O Standards | — | LVDS, LVPECL |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded block RAM capacity] |