A3PE3000L-FG484I vs A3PE3000L-FG484 तुलना
विस्तृत दोनों ओर की तुलना A3PE3000L-FG484I द्वारा Microchip Technology और A3PE3000L-FG484 द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
A3PE3000L-FG484I ✓ सक्रियMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ सक्रियविशेषता तुलना
| पैरामीटर | A3PE3000L-FG484I | A3PE3000L-FG484 |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | ProASIC3L (ProASIC3 Low Power) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 (3.00E6) | 3000000 |
| Logic Cells (DFFs) | 75264 | — |
| User I/O (this package) | 341 | — |
| Max User I/O (family) | 616 | — |
| Embedded SRAM | 504 kbit true dual-port | — |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V typical) | — |
| Configuration | Nonvolatile flash, Live-at-Power-Up Level 0 | Flash-based, Instant On, single-chip |
| Single-Chip Solution | Yes (no external configuration PROM) | — |
| ऑपरेटिंग तापमान | -40C to +100C (TJ, industrial) | [DATA_NEEDED: Operating Temperature] |
| पैकेज | 484-ball FBGA (23x23 mm, 1 mm pitch) | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Speed | [DATA_NEEDED: speed grade / max frequency] | — |
| RoHS स्थिति | ROHS3 Compliant | [DATA_NEEDED: RoHS compliance] |
| Packaging | Tray | — |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Family | CMOS | — |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Technology | — | 130 nm CMOS flash, nonvolatile |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |
| Embedded Memory | — | [DATA_NEEDED: Embedded RAM block capacity] |