AFS600-FGG256I vs M7AFS600-FG256I तुलना
विस्तृत दोनों ओर की तुलना AFS600-FGG256I द्वारा Microchip Technology और M7AFS600-FG256I द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology
AFS600-FGG256I ✓ सक्रियMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ सक्रियविशेषता तुलना
| पैरामीटर | AFS600-FGG256I | M7AFS600-FG256I |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| System Gates | 600,000 gates | 600K |
| Device Type | Fusion mixed-signal FPGA | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Configuration Memory | Nonvolatile flash | — |
| Power-Up Configuration | Live at Power-Up (LAPU) | — |
| System Performance Frequency | 350 MHz | — |
| सप्लाई वोल्टेज | 1.5 V | — |
| Logic Family | CMOS | — |
| Total Pin Count | 256 pins | — |
| Package Type | BGA-256 | — |
| Package Pitch | 1.0 mm | — |
| Package Form | Square | — |
| Terminal Type | Ball | — |
| ऑपरेटिंग तापमान | 0°C to +70°C | — |
| Temperature Grade | Industrial | — |
| Programmable Analog Resources | Configurable analog blocks | — |
| Embedded Flash | Large flash memory blocks | — |
| Clock Management | Comprehensive clock generation and management circuitry | — |
| Programming Interface | [DATA_NEEDED: programming interface] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Maximum I/O Current | [DATA_NEEDED: maximum I/O current] | — |
| Junction Temperature | [DATA_NEEDED: junction temperature rating] | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| पैकेज / केस | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| माउंटिंग स्टाइल | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |