AFS600-FGG256I vs M7AFS600-FG256I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-FGG256I sa pamamagitan ng Microchip Technology at M7AFS600-FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
AFS600-FGG256I AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology

AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology

AFS600-FGG256I ✓ Nakahanda
Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro AFS600-FGG256I M7AFS600-FG256I
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
System Gates 600,000 gates 600K
Device Type Fusion mixed-signal FPGA —
Process Technology 130 nm CMOS 130 nm
Metal Layers 7 layers —
Configuration Memory Nonvolatile flash —
Power-Up Configuration Live at Power-Up (LAPU) —
System Performance Frequency 350 MHz —
Volte ng Pagbibigay 1.5 V —
Logic Family CMOS —
Total Pin Count 256 pins —
Package Type BGA-256 —
Package Pitch 1.0 mm —
Package Form Square —
Terminal Type Ball —
Temperature na Operasyon 0°C to +70°C —
Temperature Grade Industrial —
Programmable Analog Resources Configurable analog blocks —
Embedded Flash Large flash memory blocks —
Clock Management Comprehensive clock generation and management circuitry —
Programming Interface [DATA_NEEDED: programming interface] —
I/O Standards [DATA_NEEDED: supported I/O standards] —
Maximum I/O Current [DATA_NEEDED: maximum I/O current] —
Junction Temperature [DATA_NEEDED: junction temperature rating] —
Series — M7AFS600 (Fusion)
Logic Capacity (DigiKey listing) — 110592
Number of I/O — 119 I/O
Embedded Processor — ARM CoreMP7
Core Supply Voltage — 1.5 V
Packhaging / Kaso — 256-LBGA (FBGA)
Terminal Form — Ball
Package Shape — Square
Style ng Pagpapasok — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Packaging — Tray
Programmable Logic Type — Flash-based, non-volatile
Analog Integration — Mixed-signal (configurable analog + flash memory)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita