EP20K1000CF672C8 vs EP20K1000CF672C9N तुलना
विस्तृत दोनों ओर की तुलना EP20K1000CF672C8 द्वारा Intel और EP20K1000CF672C9N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP20K1000CF672C8 | EP20K1000CF672C9N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Device Type | Field Programmable Gate Array (FPGA) | Loadable PLD / FPGA |
| Series | APEX 20KC | — |
| System Gates | 1,000,000 | 1,000,000 |
| Logic Elements / Cells | 38,400 | — |
| Embedded RAM | 327,680 bits | — |
| User I/Os | 488 (datasheet), 508 (per some distributor listings) | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Number of Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Number of PLLs | 4 | — |
| Maximum User I/O Pins | 488 | — |
| Process Technology | 0.15 um all-layer copper CMOS | 0.15 micron all-layer copper CMOS |
| Core Voltage (VCCINT) | 1.8 V (typical) | — |
| I/O Voltage (VCCIO) | Multi-voltage (LVTTL/LVCMOS/LVDS/SSTL/GTL+ compatible) | — |
| Propagation Delay (typical) | 1.6 ns | — |
| पैकेज | 672-ball FineLine BGA, 45 x 45 mm, 1.27 mm pitch | 672-ball FC-FBGA (flip-chip) |
| ऑपरेटिंग तापमान | 0C to 85C (commercial) | 0 C to 85 C (Commercial) |
| Configuration Mode | FPP / Passive Serial / JTAG | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| RoHS स्थिति | unknown (legacy part, verify on lot) | [DATA_NEEDED: RoHS status] |
| Family | — | APEX 20KC |
| Logic Elements | — | 38,400 |
| Embedded Memory | — | 327,680 bits |
| Maximum User I/O | — | 508 |
| Core Voltage | — | 1.8 V |
| Maximum Frequency | — | 250 MHz |
| Propagation Delay (pin-to-pin) | — | 1.6 ns |
| Package Body Size | — | 27 mm x 27 mm |
| Ball Pitch | — | 1.0 mm |
| PLLs | — | 4 |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |