EP20K1000CF672C8 vs EP20K1000CF672C9N Perbandingan
Perbandingan bersamaan detil EP20K1000CF672C8 dari Intel dan EP20K1000CF672C9N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP20K1000CF672C8 | EP20K1000CF672C9N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Device Type | Field Programmable Gate Array (FPGA) | Loadable PLD / FPGA |
| Series | APEX 20KC | — |
| System Gates | 1,000,000 | 1,000,000 |
| Logic Elements / Cells | 38,400 | — |
| Embedded RAM | 327,680 bits | — |
| User I/Os | 488 (datasheet), 508 (per some distributor listings) | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Number of Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Number of PLLs | 4 | — |
| Maximum User I/O Pins | 488 | — |
| Process Technology | 0.15 um all-layer copper CMOS | 0.15 micron all-layer copper CMOS |
| Core Voltage (VCCINT) | 1.8 V (typical) | — |
| I/O Voltage (VCCIO) | Multi-voltage (LVTTL/LVCMOS/LVDS/SSTL/GTL+ compatible) | — |
| Propagation Delay (typical) | 1.6 ns | — |
| Paket | 672-ball FineLine BGA, 45 x 45 mm, 1.27 mm pitch | 672-ball FC-FBGA (flip-chip) |
| Suhu Kerja | 0C to 85C (commercial) | 0 C to 85 C (Commercial) |
| Configuration Mode | FPP / Passive Serial / JTAG | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | unknown (legacy part, verify on lot) | [DATA_NEEDED: RoHS status] |
| Family | — | APEX 20KC |
| Logic Elements | — | 38,400 |
| Embedded Memory | — | 327,680 bits |
| Maximum User I/O | — | 508 |
| Core Voltage | — | 1.8 V |
| Maximum Frequency | — | 250 MHz |
| Propagation Delay (pin-to-pin) | — | 1.6 ns |
| Package Body Size | — | 27 mm x 27 mm |
| Ball Pitch | — | 1.0 mm |
| PLLs | — | 4 |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |