EP20K1000CF672C8 vs EP20K1000CF672C9N 比較
詳細並排比較 EP20K1000CF672C8 由 Intel 與 EP20K1000CF672C9N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP20K1000CF672C8 | EP20K1000CF672C9N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Device Type | Field Programmable Gate Array (FPGA) | Loadable PLD / FPGA |
| Series | APEX 20KC | — |
| System Gates | 1,000,000 | 1,000,000 |
| Logic Elements / Cells | 38,400 | — |
| Embedded RAM | 327,680 bits | — |
| User I/Os | 488 (datasheet), 508 (per some distributor listings) | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Number of Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Number of PLLs | 4 | — |
| Maximum User I/O Pins | 488 | — |
| Process Technology | 0.15 um all-layer copper CMOS | 0.15 micron all-layer copper CMOS |
| Core Voltage (VCCINT) | 1.8 V (typical) | — |
| I/O Voltage (VCCIO) | Multi-voltage (LVTTL/LVCMOS/LVDS/SSTL/GTL+ compatible) | — |
| Propagation Delay (typical) | 1.6 ns | — |
| 封裝 | 672-ball FineLine BGA, 45 x 45 mm, 1.27 mm pitch | 672-ball FC-FBGA (flip-chip) |
| 工作溫度 | 0C to 85C (commercial) | 0 C to 85 C (Commercial) |
| Configuration Mode | FPP / Passive Serial / JTAG | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| RoHS 狀態 | unknown (legacy part, verify on lot) | [DATA_NEEDED: RoHS status] |
| Family | — | APEX 20KC |
| Logic Elements | — | 38,400 |
| Embedded Memory | — | 327,680 bits |
| Maximum User I/O | — | 508 |
| Core Voltage | — | 1.8 V |
| Maximum Frequency | — | 250 MHz |
| Propagation Delay (pin-to-pin) | — | 1.6 ns |
| Package Body Size | — | 27 mm x 27 mm |
| Ball Pitch | — | 1.0 mm |
| PLLs | — | 4 |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |