EP20K600CB672C8N vs EP20K600CF672 तुलना
विस्तृत दोनों ओर की तुलना EP20K600CB672C8N द्वारा Intel और EP20K600CF672 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]विशेषता तुलना
| पैरामीटर | EP20K600CB672C8N | EP20K600CF672 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Family | APEX-20KC | — |
| Logic Elements (LEs) | 24,320 | — |
| Embedded Memory Bits | 311,296 | — |
| Maximum User I/O | 508 | — |
| पैकेज | 672-BBGA (FineLine BGA) | — |
| Configuration Memory | SRAM, in-system programmable | [DATA_NEEDED: configuration memory type and capacity] |
| Configuration Schemes | Passive Serial / Active Serial / JTAG (IEEE 1149.1) | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Process Technology | 0.18 µm CMOS | 0.15 um all-layer copper-metal process for supplied family references |
| ऑपरेटिंग तापमान | Commercial (0C to +85C) | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Speed Grade | C8 | — |
| PCI Support | PCI-SIG compliant 3.3 V, 33/66 MHz, 32/64-bit | — |
| External Memory Interface | DDR SDRAM, ZBT SRAM | — |
| Dedicated Clock Inputs | 16 | — |
| PLLs | On-chip with clock-doubling and phase-shift | — |
| LVDS Channels | Up to 32 | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | unknown |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Propagation Delay | — | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |