EP20K600CB672C8N vs EP20K600CF672 Perbandingan
Perbandingan bersamaan detil EP20K600CB672C8N dari Intel dan EP20K600CF672 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Perbandingan Spesifikasi
| Parameter Umum | EP20K600CB672C8N | EP20K600CF672 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Family | APEX-20KC | — |
| Logic Elements (LEs) | 24,320 | — |
| Embedded Memory Bits | 311,296 | — |
| Maximum User I/O | 508 | — |
| Paket | 672-BBGA (FineLine BGA) | — |
| Configuration Memory | SRAM, in-system programmable | [DATA_NEEDED: configuration memory type and capacity] |
| Configuration Schemes | Passive Serial / Active Serial / JTAG (IEEE 1149.1) | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Process Technology | 0.18 µm CMOS | 0.15 um all-layer copper-metal process for supplied family references |
| Suhu Kerja | Commercial (0C to +85C) | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Speed Grade | C8 | — |
| PCI Support | PCI-SIG compliant 3.3 V, 33/66 MHz, 32/64-bit | — |
| External Memory Interface | DDR SDRAM, ZBT SRAM | — |
| Dedicated Clock Inputs | 16 | — |
| PLLs | On-chip with clock-doubling and phase-shift | — |
| LVDS Channels | Up to 32 | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Propagation Delay | — | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |