EP2A40F1020C8 vs EP2A40F1020C7N तुलना
विस्तृत दोनों ओर की तुलना EP2A40F1020C8 द्वारा Intel और EP2A40F1020C7N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP2A40F1020C7N - APEX II 1.5M Gates FPGA, 735 I/O, FC-FBGA-1020 | Intel
EP2A40F1020C7N Obsoleteविशेषता तुलना
| पैरामीटर | EP2A40F1020C8 | EP2A40F1020C7N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | Obsolete |
| Family | APEX II | APEX II |
| Logic Family | CMOS | CMOS |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| System Gates | 1,500,000 | 1,500,000 (1.5 M) |
| Logic Cells | 38,400 | — |
| Macros / Macro Cells | 2,560 | — |
| Embedded RAM | [DATA_NEEDED: total ESB bits] | — |
| Maximum Internal Frequency | 376 MHz | — |
| Propagation Delay | 1.55 ns | 1.55 ns |
| User I/O Pins | 735 | 735 |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | MultiVolt 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Package Type | FC-FBGA (FineLine BGA) | — |
| Package Pin Count | 1020 | — |
| Package Dimensions | 33 x 33 mm | — |
| Ball Pitch | 1.0 mm | — |
| ऑपरेटिंग तापमान | 0 C to +85 C (commercial, 'C' suffix) | 0 °C to +85 °C (commercial, C7 grade) |
| RoHS स्थिति | [DATA_NEEDED: confirm per lot] | — |
| Configuration Interface | JTAG / Altera serial | — |
| Design Toolchain | Quartus II (legacy version 4.x or earlier recommended) | — |
| Technology | — | 0.15 µm all-layer copper CMOS, up to 8 metal layers |
| Logic Elements | — | 38,400 |
| Embedded Memory | — | ESB-based, 504 Kbits total |
| Maximum Internal Performance | — | 562 MHz |
| PLLs | — | 4 |
| Clock Networks | — | 12 |
| True-LVDS Data Rate | — | 1 Gbps |
| Supported I/O Standards | — | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, SSTL |
| Core Supply Voltage | — | 1.5 V nominal (1.425 V – 1.575 V) |
| पैकेज | — | FC-FBGA-1020, 33 × 33 mm, 1.0 mm pitch, fine-line |
| Terminal Form | — | BGA ball (flip-chip) |
| माउंटिंग प्रकार | — | Surface Mount |