EP2A40F1020C8 vs EP2A40F1020C7N Perbandingan
Perbandingan bersamaan detil EP2A40F1020C8 dari Intel dan EP2A40F1020C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2A40F1020C7N - APEX II 1.5M Gates FPGA, 735 I/O, FC-FBGA-1020 | Intel
EP2A40F1020C7N ObsoletePerbandingan Spesifikasi
| Parameter Umum | EP2A40F1020C8 | EP2A40F1020C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | APEX II | APEX II |
| Logic Family | CMOS | CMOS |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| System Gates | 1,500,000 | 1,500,000 (1.5 M) |
| Logic Cells | 38,400 | — |
| Macros / Macro Cells | 2,560 | — |
| Embedded RAM | [DATA_NEEDED: total ESB bits] | — |
| Maximum Internal Frequency | 376 MHz | — |
| Propagation Delay | 1.55 ns | 1.55 ns |
| User I/O Pins | 735 | 735 |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | MultiVolt 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Package Type | FC-FBGA (FineLine BGA) | — |
| Package Pin Count | 1020 | — |
| Package Dimensions | 33 x 33 mm | — |
| Ball Pitch | 1.0 mm | — |
| Suhu Kerja | 0 C to +85 C (commercial, 'C' suffix) | 0 °C to +85 °C (commercial, C7 grade) |
| Status RoHS | [DATA_NEEDED: confirm per lot] | — |
| Configuration Interface | JTAG / Altera serial | — |
| Design Toolchain | Quartus II (legacy version 4.x or earlier recommended) | — |
| Technology | — | 0.15 µm all-layer copper CMOS, up to 8 metal layers |
| Logic Elements | — | 38,400 |
| Embedded Memory | — | ESB-based, 504 Kbits total |
| Maximum Internal Performance | — | 562 MHz |
| PLLs | — | 4 |
| Clock Networks | — | 12 |
| True-LVDS Data Rate | — | 1 Gbps |
| Supported I/O Standards | — | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, SSTL |
| Core Supply Voltage | — | 1.5 V nominal (1.425 V – 1.575 V) |
| Paket | — | FC-FBGA-1020, 33 × 33 mm, 1.0 mm pitch, fine-line |
| Terminal Form | — | BGA ball (flip-chip) |
| Tipe Mounting | — | Surface Mount |