EP2AGX45DF25C4N vs EP2AGX45DF25C5N तुलना
विस्तृत दोनों ओर की तुलना EP2AGX45DF25C4N द्वारा Intel और EP2AGX45DF25C5N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2AGX45DF25C4N | EP2AGX45DF25C5N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Family | Arria II GX | Arria II GX |
| Series | EP2AGX45 | Arria II GX |
| Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total Embedded RAM Bits | 3,517,440 | — |
| M9K Memory Blocks | 273 | — |
| Embedded 18x18 Multipliers | 56 | — |
| User I/O Pins | 252 | — |
| Maximum User I/O (per datasheet) | 252 (FBGA-572 device) | — |
| Transceivers | 16 channels (data rates up to 3.75 Gbps, per family) | — |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Maximum Operating Frequency | 500 MHz (per third-party listing) | — |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Supply Voltage | 0.9 V | 0.9 V |
| ऑपरेटिंग तापमान | 0C to +85C (commercial, 'C' grade) | — |
| Speed Grade | C4 | C5 (commercial, -20 °C to +85 °C) |
| पैकेज | 572-ball FC-FBGA (DF25) | 572-ball FC-FBGA (Flip-Chip BGA), 25 × 25 mm |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS स्थिति | Compliant (Pb-free 'N' suffix) | — |
| Configuration Interface | Serial / JTAG | — |
| Number of Logic Elements (LEs) | — | 42,959 |
| Number of LABs/CLBs | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| Number of User I/O | — | 252 |
| Number of Transceivers | — | 4 or 8 (device-dependent) |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| Maximum Internal Frequency | — | 500 MHz |
| Lead-Free / RoHS | — | Lead Free (MSL per JEDEC J-STD-020) |
| PCI Express Hard IP | — | Yes, PCIe Gen1 ×1/×4 |
| Configuration Modes | — | JTAG, AS, PS, FPP |