EP2AGX45DF25C4N vs EP2AGX45DF25C5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX45DF25C4N disebabkan oleh Intel dan EP2AGX45DF25C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGX45DF25C4N | EP2AGX45DF25C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Arria II GX | Arria II GX |
| Series | EP2AGX45 | Arria II GX |
| Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total Embedded RAM Bits | 3,517,440 | — |
| M9K Memory Blocks | 273 | — |
| Embedded 18x18 Multipliers | 56 | — |
| User I/O Pins | 252 | — |
| Maximum User I/O (per datasheet) | 252 (FBGA-572 device) | — |
| Transceivers | 16 channels (data rates up to 3.75 Gbps, per family) | — |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Maximum Operating Frequency | 500 MHz (per third-party listing) | — |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Supply Voltage | 0.9 V | 0.9 V |
| Suhu Operasi | 0C to +85C (commercial, 'C' grade) | — |
| Speed Grade | C4 | C5 (commercial, -20 °C to +85 °C) |
| Kemasan | 572-ball FC-FBGA (DF25) | 572-ball FC-FBGA (Flip-Chip BGA), 25 × 25 mm |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant (Pb-free 'N' suffix) | — |
| Configuration Interface | Serial / JTAG | — |
| Number of Logic Elements (LEs) | — | 42,959 |
| Number of LABs/CLBs | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| Number of User I/O | — | 252 |
| Number of Transceivers | — | 4 or 8 (device-dependent) |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| Maximum Internal Frequency | — | 500 MHz |
| Lead-Free / RoHS | — | Lead Free (MSL per JEDEC J-STD-020) |
| PCI Express Hard IP | — | Yes, PCIe Gen1 ×1/×4 |
| Configuration Modes | — | JTAG, AS, PS, FPP |