EP2AGZ350HF40C3N vs EP2AGZ350HF40I2N तुलना
विस्तृत दोनों ओर की तुलना EP2AGZ350HF40C3N द्वारा Intel और EP2AGZ350HF40I2N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2AGZ350HF40C3N | EP2AGZ350HF40I2N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 350000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 24 (per family datasheet) | Embedded multi-gigabit transceivers |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| पैकेज | 1517-ball FCBGA (HF40) | 1517-pin FBGA (HF40) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| माउंटिंग प्रकार | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| ऑपरेटिंग तापमान | — | -40C to +100C (Industrial) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Embedded Memory | — | [DATA_NEEDED: Mbits] |
| User I/O Banks | — | [DATA_NEEDED: bank count] |
| Maximum User I/O | — | [DATA_NEEDED: max user I/O count] |
| Process Node | — | [DATA_NEEDED: process node nm] |
| RoHS स्थिति | — | Compliant |
| Lead-Free | — | Yes |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |
| AEC-Q100 | — | not_applicable |