EP2AGZ350HF40C3N vs EP2AGZ350HF40I2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ350HF40C3N disebabkan oleh Intel dan EP2AGZ350HF40I2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ350HF40C3N | EP2AGZ350HF40I2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 350000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 24 (per family datasheet) | Embedded multi-gigabit transceivers |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| Kemasan | 1517-ball FCBGA (HF40) | 1517-pin FBGA (HF40) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Embedded Memory | — | [DATA_NEEDED: Mbits] |
| User I/O Banks | — | [DATA_NEEDED: bank count] |
| Maximum User I/O | — | [DATA_NEEDED: max user I/O count] |
| Process Node | — | [DATA_NEEDED: process node nm] |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| AEC-Q100 | — | not_applicable |