EP4SGX360FF35C2XN vs EP4SGX360FF35C4N तुलना
विस्तृत दोनों ओर की तुलना EP4SGX360FF35C2XN द्वारा Intel और EP4SGX360FF35C4N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP4SGX360FF35C2XN | EP4SGX360FF35C4N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | Obsolete |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 141,440 (Mouser reports 14,144 LABs) |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | — |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | — |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| पैकेज | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1152-ball FC-BGA (FF35) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (BGA) |
| ऑपरेटिंग तापमान | 0C to +85C (Commercial) | — |
| RoHS स्थिति | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Memory Bits | — | 23,105,536 bits (~22 Mbit) |
| Maximum User I/Os | — | 564 |
| Number of LABs/CLBs | — | 14144 |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| Core Voltage | — | 0.9 V |
| Operating Temperature Grade | — | Commercial (C4) |
| Series | — | Stratix IV GX |
| Part Status | — | Obsolete (per Micropcba / distributor listings) |