EPF10K100ARC240-2 vs EPF10K100BQC240-1 तुलना
विस्तृत दोनों ओर की तुलना EPF10K100ARC240-2 द्वारा Altera और EPF10K100BQC240-1 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EPF10K100BQC240-1 - 100K FLEX-10K FPGA, 240-PQFP | Intel / Altera
EPF10K100BQC240-1 ⚠ अंतिम खरीदविशेषता तुलना
| पैरामीटर | EPF10K100ARC240-2 | EPF10K100BQC240-1 |
|---|---|---|
| ब्रांड | Altera | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | अंतिम बार खरीदें |
| Series / Family | FLEX 10KA (FLEX 10K embedded PLD family) | — |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 4,992 | 6,144 |
| Logic Array Blocks (LABs) | 624 | — |
| Typical Gate Count | 100,000 gates | — |
| Embedded Memory | 24,576 RAM bits | — |
| Number of User I/Os | 189 | — |
| Maximum Operating Frequency | 142.86 MHz | — |
| Propagation Delay | 0.600 ns (distributor parametric listing; see validation note) | — |
| सप्लाई वोल्टेज | 3.3 V | — |
| Logic Family | CMOS | — |
| Speed Grade | -2 | -1 |
| पैकेज / केस | 240-pin RQFP (BFQFP) with exposed pad | — |
| Number of Terminals | 240 | — |
| Terminal Form | Gull wing | — |
| Package Shape | Square | — |
| माउंटिंग प्रकार | Surface mount | Surface Mount |
| ऑपरेटिंग तापमान रेंज | 0 C to +70 C (commercial grade) | — |
| Temperature Grading | Commercial | — |
| Configuration Memory Technology | [DATA_NEEDED: configuration memory technology] | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status of the -2 speed grade] | [DATA_NEEDED: RoHS compliance] |
| Series | — | FLEX-10K |
| Family | — | FLEX-10K (EPF10K100B) |
| Typical Gates | — | 100,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 24,576 (12 × 2,048 bits per EAB) |
| Maximum User I/O | — | 189 |
| Supply Voltage (VCCINT / VCCIO) | — | 4.75 V to 5.25 V |
| Combinatorial tPD (typical) | — | 11 ns |
| पैकेज | — | 240-pin BFQFP / PQFP (BQC suffix) |
| Package Dimensions | — | 32 mm × 32 mm |
| Process Technology | — | 0.42 µm SRAM CMOS |
| ऑपरेटिंग तापमान | — | 0 °C to +70 °C (commercial) |
| Configuration Method | — | ByteBlasterMV / BitBlaster / JTAG |
| MSL स्तर | — | 3 (per JEDEC J-STD-020) |