EPF10K200EBC600-3 vs EPF10K200EBI600-2N तुलना
विस्तृत दोनों ओर की तुलना EPF10K200EBC600-3 द्वारा Intel और EPF10K200EBI600-2N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 Obsolete
विशेषता तुलना
| पैरामीटर | EPF10K200EBC600-3 | EPF10K200EBI600-2N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Series | FLEX-10KE | — |
| System Gates | 200,000 | — |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory (EABs) | 24,576 bits | — |
| Maximum User I/O | 470 | — |
| Number of PLLs | 4 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Process Technology | 0.22 micrometer SRAM | — |
| Speed Grade | -3 (commercial) | — |
| पैकेज | 600-ball FineLine BGA, 45 x 45 mm | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (BGA) |
| ऑपरेटिंग तापमान | 0C to +70C (commercial) | 0 °C to +70 °C (commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Typical Gates | — | 200,000 |
| Maximum System Gates | — | 513,000 |
| Logic Elements (LEs) | — | 9,984 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 98,304 |
| User I/O Pins | — | 470 |
| Dedicated Inputs | — | 6 |
| Technology / Process | — | 0.22 µm CMOS SRAM |
| Core Supply Voltage | — | 2.5 V (2.3 V to 2.7 V) |
| I/O Supply Voltage | — | 2.5 V / 3.3 V (5 V tolerant I/O available) |
| Propagation Delay | — | 0.4 ns to 0.6 ns (per LE) |
| Maximum Internal Frequency | — | 200 MHz |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM |
| MSL स्तर | — | [DATA_NEEDED: moisture sensitivity level] |