EPF10K250EFC672-2 vs EPF10K250EFC672-3 तुलना
विस्तृत दोनों ओर की तुलना EPF10K250EFC672-2 द्वारा Intel और EPF10K250EFC672-3 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EPF10K250EFC672-2 | EPF10K250EFC672-3 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,480 | — |
| Typical Gates | 250,000 | — |
| Embedded Array Blocks (EABs) | 20 | — |
| Maximum User RAM Bits | 40,960 | — |
| User I/Os | 470 | — |
| पैकेज | 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch | 672-ball FineLine BGA (FC) |
| पिन काउंट | 672 | — |
| Propagation Delay | 0.4 ns | — |
| ऑपरेटिंग तापमान | 0 C to +70 C (Commercial) | — |
| Core Supply Voltage | 2.3 V (typical 2.5 V) | 2.5 V |
| I/O Standard Support | 1.8 V, 2.5 V, 3.3 V (multi-volt I/O) | — |
| Logic Family | CMOS, SRAM-based | — |
| Configuration | SRAM, in-system programmable (ISP) via JTAG | — |
| Boundary Scan | IEEE 1149.1 (JTAG) compliant | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| RoHS स्थिति | Non-RoHS Compliant (per Fly-Wing listing) | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] |
| Product Type | — | FPGA (Field Programmable Gate Array) |
| Maximum Typical Gates | — | 250,000 |
| Logic Elements (LEs) | — | 12,160 |
| Embedded Memory (EAB) | — | 655,360 bits (80 EABs x 2,048 bits each) |
| Logic Array Blocks (LABs) | — | 392 (8 LEs per LAB) |
| User I/O Pins | — | 470 |
| I/O Supply Voltage | — | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | — | -3 (fastest) |
| Temperature Grade | — | Commercial (0C to +70C) |
| Ball Pitch | — | 1.0 mm |
| Configuration Mode | — | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM |
| Process Technology | — | 0.25 um CMOS, 5-layer metal |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |