EPF10K250EFC672-2 vs EPF10K250EFC672-3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K250EFC672-2 disebabkan oleh Intel dan EPF10K250EFC672-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPF10K250EFC672-2 EPF10K250EFC672-3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Family FLEX 10KE FLEX 10KE
Logic Elements 12,480 —
Typical Gates 250,000 —
Embedded Array Blocks (EABs) 20 —
Maximum User RAM Bits 40,960 —
User I/Os 470 —
Kemasan 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch 672-ball FineLine BGA (FC)
Kiraan Pin 672 —
Propagation Delay 0.4 ns —
Suhu Operasi 0 C to +70 C (Commercial) —
Core Supply Voltage 2.3 V (typical 2.5 V) 2.5 V
I/O Standard Support 1.8 V, 2.5 V, 3.3 V (multi-volt I/O) —
Logic Family CMOS, SRAM-based —
Configuration SRAM, in-system programmable (ISP) via JTAG —
Boundary Scan IEEE 1149.1 (JTAG) compliant —
Jenis Pemasangan Surface Mount Surface Mount
Status RoHS Non-RoHS Compliant (per Fly-Wing listing) [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing]
Product Type — FPGA (Field Programmable Gate Array)
Maximum Typical Gates — 250,000
Logic Elements (LEs) — 12,160
Embedded Memory (EAB) — 655,360 bits (80 EABs x 2,048 bits each)
Logic Array Blocks (LABs) — 392 (8 LEs per LAB)
User I/O Pins — 470
I/O Supply Voltage — MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V
Speed Grade — -3 (fastest)
Temperature Grade — Commercial (0C to +70C)
Ball Pitch — 1.0 mm
Configuration Mode — JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM
Process Technology — 0.25 um CMOS, 5-layer metal
Lead-Free — [DATA_NEEDED: lead-free status]

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