EPF8282ATC100-3 vs EPF8282ALC84-2 तुलना
विस्तृत दोनों ओर की तुलना EPF8282ATC100-3 द्वारा Intel और EPF8282ALC84-2 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EPF8282ATC100-3 | EPF8282ALC84-2 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Family | FLEX 8000 | FLEX 8000 |
| Logic Cells (LEs) | 208 | — |
| Usable Gates | 2,500 | 2,500 |
| Typical Gates Equivalent | 12,000 | — |
| Maximum User I/O | 78 | — |
| Number of Logic Array Blocks (LABs) | 26 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Total RAM Bits | 12 Kbits | — |
| Process Technology | 0.42 micron CMOS SRAM | 0.42 micrometer CMOS, SRAM-based |
| Supply Voltage (Core) | 5 V | — |
| MultiVolt I/O Support | 3.3 V / 5 V | — |
| Maximum Frequency | 125 MHz | — |
| Speed Grade | -3 | -2 |
| पैकेज | 100-pin TQFP (100-TQFP) | 84-pin LCC (J-Lead), PLCC-84 |
| Configuration Method | SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor | External configuration device (EPC1/EPC1441) or JTAG |
| Operating Temperature (Commercial) | 0 C to +70 C | — |
| In-Circuit Reconfigurable | Yes (ICR) | — |
| Boundary Scan | JTAG IEEE 1149.1 | — |
| Device Logic Elements / FFs | — | 208 |
| Logic Array Blocks (LABs) | — | 26 |
| Maximum User I/Os | — | 68 |
| Core Supply Voltage | — | 5.0 V |
| In-Circuit Reconfigurability | — | Yes (ICR) |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Temperature Grade (this part) | — | Commercial (suffix 'C' in package code) |
| RoHS स्थिति | — | Unknown (legacy Altera part, pre-RoHS transition) |
| Lead-Free | — | Unknown |
| माउंटिंग प्रकार | — | Surface Mount (J-Lead) |