M1AFS1500-1FGG676I vs M1AFS1500-1FGG676 तुलना
विस्तृत दोनों ओर की तुलना M1AFS1500-1FGG676I द्वारा Microchip Technology और M1AFS1500-1FGG676 द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
M1AFS1500-1FGG676I - Fusion Mixed-Signal FPGA 252 I/O | Microchip
M1AFS1500-1FGG676I ✓ सक्रियMicrochip Technology
M1AFS1500-1FGG676 - Fusion FPGA 1.5M Gates 676-FBGA | Microchip
M1AFS1500-1FGG676 ✓ सक्रियविशेषता तुलना
| पैरामीटर | M1AFS1500-1FGG676I | M1AFS1500-1FGG676 |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Fusion (Mixed-Signal FPGA) | — |
| System Gates | 1.5 M gates | — |
| Logic Resources | 276480 bits | — |
| User I/O | 252 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based | — |
| Configuration Memory | Flash (non-volatile, instant-on) | Flash (non-volatile, live at power-up) |
| Speed Grade | -1 | -1 |
| पैकेज | 676-pin FBGA (FGG676) | — |
| ऑपरेटिंग तापमान | -40C to +85C (industrial) | — |
| माउंटिंग प्रकार | Surface Mount | — |
| Analog Peripherals | Integrated configurable analog blocks (voltage, current, temperature monitoring) | — |
| Embedded Flash Memory | Large flash memory blocks integrated | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| On-Chip Frequency Characterization | 1282.05 MHz (datasheet family metric) | — |
| Packaging | Tray | Tray |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | unknown |
| MSL स्तर | [DATA_NEEDED: moisture sensitivity level] | — |
| Manufacturer Part Number | — | M1AFS1500-1FGG676 |
| Series | — | M1AFS1500 (Fusion) |
| Number of Equivalent Gates | — | 1,500,000 gates |
| Number of Logic Cells | — | 38,400 |
| अधिकतम क्लॉक फ़्रीक्वेंसी | — | 350 MHz |
| Number of I/O | — | 252 I/O |
| Technology | — | 130 nm CMOS flash-based |
| पैकेज / केस | — | FBGA-676 (676-ball BGA, 1.00 mm ball pitch) |
| माउंटिंग स्टाइल | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Analog Integration | — | Configurable analog blocks (mixed-signal Fusion architecture) |