M1AFS250-1FG256 vs M1AFS250-1FGG256I तुलना
विस्तृत दोनों ओर की तुलना M1AFS250-1FG256 द्वारा Microchip Technology और M1AFS250-1FGG256I द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS250-1FG256 ✓ सक्रियMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ सक्रियविशेषता तुलना
| पैरामीटर | M1AFS250-1FG256 | M1AFS250-1FGG256I |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Fusion (M1 series, mixed-signal FPGA) | — |
| System Gates | 250000 gates | 250,000 gates |
| Processor Core | ARM Cortex-M1 | ARM Cortex-M1 (optional ARM support, M1 variant) |
| User I/O | 114 | — |
| User Flash Memory | 36864 bits | — |
| Core Supply Voltage | 1.5 V | — |
| Technology | 130 nm flash-based | 130-nm, 7-layer metal, flash-based CMOS |
| Maximum Performance | 1282.05 MHz (per FindIC spec summary) | — |
| Configuration | Flash-based, live at power-up | — |
| Security | 128-bit flash lock, AES decryption | 128-bit flash-based lock, AES decryption |
| पैकेज | 256-LBGA (FG256) | — |
| माउंटिंग प्रकार | Surface Mount | — |
| Analog Blocks | Integrated configurable analog (Fusion) | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| ऑपरेटिंग तापमान | [DATA_NEEDED: operating temperature range] | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | M1AFS250 (Fusion) |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Configuration Memory | — | Nonvolatile flash (Live at Power-Up, LAPU) |
| ऑपरेटिंग सप्लाई वोल्टेज | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| पैकेज / केस | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| माउंटिंग स्टाइल | — | SMD/SMT |
| Packaging | — | Tray |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |