MC9S08DV60AMLH vs MC9S08DN60ACLH तुलना
विस्तृत दोनों ओर की तुलना MC9S08DV60AMLH द्वारा NXP Semiconductors और MC9S08DN60ACLH द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP
MC9S08DV60AMLH ✓ सक्रियविशेषता तुलना
| पैरामीटर | MC9S08DV60AMLH | MC9S08DN60ACLH |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Core Processor | S08 (HCS08), 8-bit | — |
| Core Size | 8-Bit | — |
| Speed | 40MHz CPU (20MHz bus) | — |
| Program Memory Size | 60KB (60K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 3K x 8 | 2 KB (2K x 8) |
| Number of I/O | 53 | 53 |
| Input-Only Pins | 1 | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 | — |
| ADC Conversion Time | 2.5 us | — |
| Connectivity | CAN (MSCAN), LIN master | — |
| Oscillator Type | External | External |
| Interrupt/Reset Sources | Up to 32 | — |
| सप्लाई वोल्टेज | 3.3V/5V | — |
| पैकेज / केस | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Instruction Set | HC08 with added BGND instruction | HC08 + BGND instruction |
| Core | — | HCS08 (S08 core) |
| डेटा बस चौड़ाई | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| ADC | — | 16-channel, 12-bit, 2.5 us conversion |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Interrupt Sources | — | Up to 32 |
| ऑपरेटिंग तापमान | — | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| RoHS स्थिति | — | Compliant |
| On-Chip Debug | — | BDM (Background Debug Mode) |