MCF51AC256BVLKE vs MC9S12D64MFUER तुलना
विस्तृत दोनों ओर की तुलना MCF51AC256BVLKE द्वारा NXP Semiconductors और MC9S12D64MFUER द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MCF51AC256BVLKE - ColdFire V1 MCU 256KB Flash 50MHz | NXP LQFP-80
MCF51AC256BVLKE ⚠ अंतिम खरीदNXP Semiconductors
MC9S12D64MFUER - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP (Tape & Reel)
MC9S12D64MFUER Nrndविशेषता तुलना
| पैरामीटर | MCF51AC256BVLKE | MC9S12D64MFUER |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | अंतिम बार खरीदें | NRND |
| Core | ColdFire V1 (32-bit RISC) | — |
| Maximum CPU Frequency | 50 MHz | — |
| Program Flash Memory | 256 KB | — |
| SRAM | 32 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| पैकेज | 80-pin LQFP (14x14 mm) | 80-QFP (14 x 14 mm), also called PQFP-80 |
| ऑपरेटिंग तापमान रेंज | -40 °C to +105 °C (industrial) | -40 C to +125 C |
| GPIO Count | Up to 69 | — |
| ADC | 12-bit SAR, up to 16 channels | 2 x 10-bit, 8 channels each (16 ADC channels total) |
| ADC Conversion Time | 2.5 µs minimum | — |
| SCI (UART) Modules | 3 | — |
| SPI Modules | 2 | — |
| I2C Modules | 2 | — |
| Timers / PWM | FlexTimer (FTM) modules with PWM | — |
| Touch Sensing Interface | TSI, up to 16 channels | — |
| Low-Power Modes | Stop, Wait with peripheral wake-up | — |
| माउंटिंग प्रकार | Surface Mount (LQFP, gull-wing) | Surface Mount (SMD/SMT) |
| RoHS स्थिति | Compliant | Compliant |
| हैलोजन फ्री | Compliant | — |
| Core Architecture | — | HCS12 (16-bit CISC) |
| CPU Core | — | S12 CPU V2 |
| Operating Frequency | — | 25 MHz |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 64 KB (64K x 8) |
| सप्लाई वोल्टेज | — | 2.5 V / 5 V |
| Number of I/O | — | 59 |
| PWM Channels | — | 8 channels |
| Capture/Compare Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC |
| Automotive Qualification | — | AEC-Q100 |
| Packaging Method (tray / reel) | — | Tray |
| Approximate Weight | — | 0.033 oz (per supplier catalog) |
| Debug Interface | — | BDM (Background Debug Mode) |
| Watchdog / COP | — | Yes (COP reset, watchdog timer) |