RTAX4000D-CQ352B vs RTAX2000D-1CQ352B तुलना

विस्तृत दोनों ओर की तुलना RTAX4000D-CQ352B द्वारा Microchip Technology और RTAX2000D-1CQ352B द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。

Microchip Technology
RTAX4000D-CQ352B RTAX4000D-CQ352B - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip

RTAX4000D-CQ352B - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip

RTAX4000D-CQ352B ✓ सक्रिय
Microchip Technology
RTAX2000D-1CQ352B RTAX2000D-1CQ352B - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000D-1CQ352B - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000D-1CQ352B ✓ सक्रिय

विशेषता तुलना

पैरामीटर RTAX4000D-CQ352B RTAX2000D-1CQ352B
ब्रांड Microchip Technology Microchip Technology
श्रेणी FPGA & CPLD FPGA & CPLD
लाइफसाइकिल स्थिति सक्रिय सक्रिय
Logic Cells 55,440 —
Configurable Logic Blocks (CLBs) 36,960 —
Equivalent Gates 4,000,000 —
System Gates (cells, per Jotrin listing) 33,600 —
Family RTAX-DSP (RTAX-S/SL/DSP) RTAX-S/SL and RTAX-DSP (RTAX2000D)
Process Technology 0.15 um —
Core Supply Voltage 1.5 V (1.425 V to 1.575 V) 1.5 V nominal (1.425 V to 1.575 V)
Combinatorial CLB Delay [DATA_NEEDED: combinatorial CLB delay for standard speed grade; 0.99 ns max is specified for the -1 speed grade variant] —
Technology Type Antifuse, one-time programmable, radiation-tolerant —
पैकेज 352-pin Ceramic CQFP (CQFP-352) 352-pin Ceramic Column Grid Array (CQ352)
माउंटिंग प्रकार Surface Mount Surface Mount (ceramic column grid array)
Configuration Live at power-up, single chip, no external configuration memory Live at power-up, no external configuration device (antifuse)
Radiation Tolerance Radiation-tolerant (space-flight qualified family) —
Application Domain Space flight systems Space-flight, radiation-tolerant
Programmability OTP (one-time programmable antifuse) —
RoHS स्थिति [DATA_NEEDED: RoHS status] —
ऑपरेटिंग तापमान [DATA_NEEDED: operating temperature range] —
Technology — Antifuse (nonvolatile), Digital CMOS
Equivalent System Gates — 2,000,000
CLBs (Logic Cells) — 19,712 CLBs / 29,568 logic cells (per family organization)
DSP Mathblocks — Up to 120 (18-bit x 18-bit MAC)
DSP Performance — 125 MHz 18-bit x 18-bit multiply-accumulate
Embedded Memory — Up to 540 kbits SRAM with optional EDAC
Total Ionizing Dose — 300 krad (Si) functional / 200 krad (Si) with operation
Speed Grade — -1
Temperature Range — Commercial (C)
Routing Features — Segmentable clocks, chip-wide highway routing, carry logic
Embedded SRAM Features — Built-in FIFO control logic

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