RTAX4000SL-CQ352EV vs RTAX2000SL-1CQ352V तुलना
विस्तृत दोनों ओर की तुलना RTAX4000SL-CQ352EV द्वारा Microchip Technology और RTAX2000SL-1CQ352V द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip
RTAX4000SL-CQ352EV ✓ सक्रियMicrochip Technology
RTAX2000SL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000SL-1CQ352V ✓ सक्रियविशेषता तुलना
| पैरामीटर | RTAX4000SL-CQ352EV | RTAX2000SL-1CQ352V |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | RTAX-SL (Radiation-Tolerant FPGA) | RTAX-S/SL Radiation-Tolerant FPGA |
| System Gates | 4,000,000 | — |
| Logic Cells (ASIC Gates) | 40,320 | — |
| Process Technology | 0.15 um CMOS antifuse | CMOS, antifuse OTP interconnect |
| Core Supply Voltage | 1.5 V | 1.5 V (1.425 V to 1.575 V) |
| पैकेज | 352-pin CQFP (Ceramic Quad Flat Pack) | 352-pin ceramic CQFP (CQ352) |
| Screening Level | EV (enhanced spaceflight screening) | — |
| Programming Technology | Antifuse (one-time programmable, live at power-up) | — |
| Radiation Tolerance | Radiation-tolerant (TID/SEL/SEU per family datasheet) | Radiation-tolerant (space flight grade) |
| Configuration | Single-chip, no external boot memory | Live at power-up, single chip (antifuse) |
| I/O Supply Voltage | [DATA_NEEDED: I/O bank voltage] | [DATA_NEEDED: I/O bank voltage] |
| Maximum System Frequency | [DATA_NEEDED: maximum system frequency] | — |
| ऑपरेटिंग तापमान | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Package Material | Hermetic ceramic (JESD-30 S-CQFP-F352) | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Typical Application | Space-flight systems, satellites, payload processing | — |
| Equivalent System Gates | — | 2,000,000 |
| CLB Count | — | 21,504 |
| Logic Cells | — | 32,256 |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control |
| Clocking | — | Segmentable clock resources, chip-wide highway routing |
| Application Domain | — | Space flight systems |
| Total Ionizing Dose (TID) | — | [DATA_NEEDED: TID rating] |
| MSL स्तर | — | Not applicable (ceramic package) |