10AS032E4F29I3SG vs 10AS048E1F29I1HG Perbandingan
Perbandingan bersamaan detil 10AS032E4F29I3SG dari Intel dan 10AS048E1F29I1HG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AS032E4F29I3SG | 10AS048E1F29I1HG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Device Type | SoC FPGA with dual ARM Cortex-A9 MPCore + CoreSight | — |
| Logic Elements | 320,000 | 480,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Core Frequency | 1.5 GHz | — |
| Core Supply Voltage | 0.9 V | — |
| Paket | 780-ball FBGA, FC (flip-chip), 29 mm × 29 mm | 780-ball FCBGA, 29x29 mm |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | 4 | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Packaging | Tray | — |
| Status Lingkungan Hidup | Active | — |
| Status RoHS | Compliant | Compliant |
| Process Node | 20 nm (Tri-Gate) | 20 nm |
| Programming Toolchain | Intel Quartus Prime | — |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | — | Up to 1.5 GHz |
| Suhu Kerja | — | -40C to +100C (Industrial) |
| Number of Terminals | — | 780 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| Level MSL | — | [DATA_NEEDED: MSL rating] |