10AS032E4F29I3SG vs 10AS048E1F29I1HG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS032E4F29I3SG disebabkan oleh Intel dan 10AS048E1F29I1HG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AS032E4F29I3SG | 10AS048E1F29I1HG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Device Type | SoC FPGA with dual ARM Cortex-A9 MPCore + CoreSight | — |
| Logic Elements | 320,000 | 480,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Core Frequency | 1.5 GHz | — |
| Core Supply Voltage | 0.9 V | — |
| Kemasan | 780-ball FBGA, FC (flip-chip), 29 mm × 29 mm | 780-ball FCBGA, 29x29 mm |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | 4 | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Packaging | Tray | — |
| Status Lingkungan Hidup | Active | — |
| Status RoHS | Compliant | Compliant |
| Process Node | 20 nm (Tri-Gate) | 20 nm |
| Programming Toolchain | Intel Quartus Prime | — |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | — | Up to 1.5 GHz |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| Number of Terminals | — | 780 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |