10AS057K2F35E1HG vs 10AS057K2F35I2SG Perbandingan
Perbandingan bersamaan detil 10AS057K2F35E1HG dari Intel dan 10AS057K2F35I2SG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AS057K2F35E1HG | 10AS057K2F35I2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 | 570K |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | [DATA_NEEDED: M20K / MLAB bit count] |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | [DATA_NEEDED: transceiver count and max data rate] |
| PCIe Hard IP | Gen2/Gen3 x8 | — |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| Paket | 1152-ball FC-BGA (F35), 35x35 mm | 1152-ball FC-FBGA (F35), 35x35 mm |
| Process Technology | 20 nm TSMC | — |
| Operating Temperature Grade | Industrial | — |
| Status RoHS | Compliant | Compliant (lead-free finish) |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Processor Core | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | — | 1.5 GHz |
| Speed Grade | — | -2 |
| Suhu Kerja | — | -40C to +100C (Industrial) |
| User I/O Count | — | 396 (per Heisener parametric data) |
| Process Node | — | 20 nm TSMC |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| HPS Peripherals | — | EMAC, USB 2.0 OTG, SPI, I2C, NAND/NOR flash controllers, SD/MMC |
| Memory Interfaces | — | DDR3/DDR4/LPDDR3 hard controllers (Arria 10 HPS) |
| Configuration | — | FPGA + HPS independent / coordinated boot |
| Tipe Mounting | — | Surface Mount (BGA) |
| Level MSL | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |