10AS057K2F35E1HG vs 10AS057K2F35I2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS057K2F35E1HG disebabkan oleh Intel dan 10AS057K2F35I2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AS057K2F35E1HG | 10AS057K2F35I2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 | 570K |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | [DATA_NEEDED: M20K / MLAB bit count] |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | [DATA_NEEDED: transceiver count and max data rate] |
| PCIe Hard IP | Gen2/Gen3 x8 | — |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| Kemasan | 1152-ball FC-BGA (F35), 35x35 mm | 1152-ball FC-FBGA (F35), 35x35 mm |
| Process Technology | 20 nm TSMC | — |
| Operating Temperature Grade | Industrial | — |
| Status RoHS | Compliant | Compliant (lead-free finish) |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Processor Core | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | — | 1.5 GHz |
| Speed Grade | — | -2 |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| User I/O Count | — | 396 (per Heisener parametric data) |
| Process Node | — | 20 nm TSMC |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| HPS Peripherals | — | EMAC, USB 2.0 OTG, SPI, I2C, NAND/NOR flash controllers, SD/MMC |
| Memory Interfaces | — | DDR3/DDR4/LPDDR3 hard controllers (Arria 10 HPS) |
| Configuration | — | FPGA + HPS independent / coordinated boot |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Aras MSL | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |