10AX090S3F45E2LG vs 10AX090S2F45E1SG Perbandingan
Perbandingan bersamaan detil 10AX090S3F45E2LG dari Intel dan 10AX090S2F45E1SG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AX090S3F45E2LG | 10AX090S2F45E1SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | — |
| Logic Elements | 900,000 | — |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Embedded Memory (bits) | 59,234,304 | — |
| DSP Blocks | 1,518 | 1,518 (variable-precision, hard floating-point) |
| Transceivers | 624 (per package aggregate channels) | 24 channels |
| Maximum Transceiver Data Rate | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) | — |
| Paket | 1932-ball FCBGA (F45, 45mm flip-chip BGA) | 1932-ball FCBGA |
| Process Node | TSMC 20nm | 20 nm TSMC |
| Core Voltage (nominal) | 0.9 V | — |
| User I/O Banks | 12 | — |
| Maximum User I/O | 624 | — |
| Rentang Suhu Kerja | 0C to 100C (E2 commercial) | — |
| Speed Grade | S3 (-2 speed grade equivalent) | -E1 (fastest) |
| Tipe Mounting | Surface Mount (BGA) | — |
| Status RoHS | Compliant | Compliant |
| Memory Interfaces | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 | — |
| Family | — | Arria 10 GX |
| Device | — | 10AX090 |
| Logic Elements (LE) | — | 900,000 |
| Embedded Memory | — | 59,234,304 bits |
| Max Transceiver Data Rate | — | 12.5 Gbps |
| Package Code | — | F45 |
| Device Variant | — | -S2 (lower-power core) |
| Operating Temperature Grade | — | Extended |
| Hard PCIe Gen3 Blocks | — | Yes, up to 96 lanes |
| Configuration Method | — | Active serial (AS), Passive serial (PS), JTAG |