10AX090S3F45E2LG vs 10AX090S2F45E1SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090S3F45E2LG sa pamamagitan ng Intel at 10AX090S2F45E1SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090S3F45E2LG | 10AX090S2F45E1SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria 10 GX | — |
| Logic Elements | 900,000 | — |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Embedded Memory (bits) | 59,234,304 | — |
| DSP Blocks | 1,518 | 1,518 (variable-precision, hard floating-point) |
| Transceivers | 624 (per package aggregate channels) | 24 channels |
| Maximum Transceiver Data Rate | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) | — |
| Packhaging | 1932-ball FCBGA (F45, 45mm flip-chip BGA) | 1932-ball FCBGA |
| Process Node | TSMC 20nm | 20 nm TSMC |
| Core Voltage (nominal) | 0.9 V | — |
| User I/O Banks | 12 | — |
| Maximum User I/O | 624 | — |
| Hanay ng Temperature na Operasyon | 0C to 100C (E2 commercial) | — |
| Speed Grade | S3 (-2 speed grade equivalent) | -E1 (fastest) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant | Compliant |
| Memory Interfaces | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 | — |
| Family | — | Arria 10 GX |
| Device | — | 10AX090 |
| Logic Elements (LE) | — | 900,000 |
| Embedded Memory | — | 59,234,304 bits |
| Max Transceiver Data Rate | — | 12.5 Gbps |
| Package Code | — | F45 |
| Device Variant | — | -S2 (lower-power core) |
| Operating Temperature Grade | — | Extended |
| Hard PCIe Gen3 Blocks | — | Yes, up to 96 lanes |
| Configuration Method | — | Active serial (AS), Passive serial (PS), JTAG |