10AX090S3F45E2LG vs 10AX090S2F45E1SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX090S3F45E2LG disebabkan oleh Intel dan 10AX090S2F45E1SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX090S3F45E2LG | 10AX090S2F45E1SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | — |
| Logic Elements | 900,000 | — |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Embedded Memory (bits) | 59,234,304 | — |
| DSP Blocks | 1,518 | 1,518 (variable-precision, hard floating-point) |
| Transceivers | 624 (per package aggregate channels) | 24 channels |
| Maximum Transceiver Data Rate | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) | — |
| Kemasan | 1932-ball FCBGA (F45, 45mm flip-chip BGA) | 1932-ball FCBGA |
| Process Node | TSMC 20nm | 20 nm TSMC |
| Core Voltage (nominal) | 0.9 V | — |
| User I/O Banks | 12 | — |
| Maximum User I/O | 624 | — |
| Gambaran Suhu Operasi | 0C to 100C (E2 commercial) | — |
| Speed Grade | S3 (-2 speed grade equivalent) | -E1 (fastest) |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Status RoHS | Compliant | Compliant |
| Memory Interfaces | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 | — |
| Family | — | Arria 10 GX |
| Device | — | 10AX090 |
| Logic Elements (LE) | — | 900,000 |
| Embedded Memory | — | 59,234,304 bits |
| Max Transceiver Data Rate | — | 12.5 Gbps |
| Package Code | — | F45 |
| Device Variant | — | -S2 (lower-power core) |
| Operating Temperature Grade | — | Extended |
| Hard PCIe Gen3 Blocks | — | Yes, up to 96 lanes |
| Configuration Method | — | Active serial (AS), Passive serial (PS), JTAG |