10AX115R2F40E2LG vs 10AX115R3F40E2SG Perbandingan
Perbandingan bersamaan detil 10AX115R2F40E2LG dari Intel dan 10AX115R3F40E2SG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AX115R2F40E2LG | 10AX115R3F40E2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | 427,200 |
| Embedded Memory Bits | 68,857,856 | — |
| Embedded Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| DSP Blocks (18x19 Multipliers) | 1,518 | — |
| User I/O Pins | 342 | — |
| Transceivers | 24 (up to 17.4 Gbps, 28.3 Gbps with -3 speed grade) | — |
| PCIe Hard IP | Gen3 x8 hard IP blocks | — |
| Memory Controllers | 2x hard DDR4/DDR3/RLDRAM3 controllers | — |
| PLLs | 24 fractional PLLs | — |
| Speed Grade | -2 | -2 |
| Temperature Grade | E2 (Extended) | E2 (0C to +100C) |
| Paket | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Process Technology | TSMC 20 nm | TSMC 20 nm |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Embedded Memory | — | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | — | 2,738 |
| DSP Blocks | — | 1,518 (variable-precision, hard FP) |
| Maximum User I/O | — | 342 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | — | DDR4/DDR3/QDR IV |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Configuration Memory | — | Embedded (no external flash required for typical use) |