10AX115R2F40E2LG vs 10AX115R3F40E2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115R2F40E2LG disebabkan oleh Intel dan 10AX115R3F40E2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115R2F40E2LG | 10AX115R3F40E2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | 427,200 |
| Embedded Memory Bits | 68,857,856 | — |
| Embedded Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| DSP Blocks (18x19 Multipliers) | 1,518 | — |
| User I/O Pins | 342 | — |
| Transceivers | 24 (up to 17.4 Gbps, 28.3 Gbps with -3 speed grade) | — |
| PCIe Hard IP | Gen3 x8 hard IP blocks | — |
| Memory Controllers | 2x hard DDR4/DDR3/RLDRAM3 controllers | — |
| PLLs | 24 fractional PLLs | — |
| Speed Grade | -2 | -2 |
| Temperature Grade | E2 (Extended) | E2 (0C to +100C) |
| Kemasan | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Process Technology | TSMC 20 nm | TSMC 20 nm |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Embedded Memory | — | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | — | 2,738 |
| DSP Blocks | — | 1,518 (variable-precision, hard FP) |
| Maximum User I/O | — | 342 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | — | DDR4/DDR3/QDR IV |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Configuration Memory | — | Embedded (no external flash required for typical use) |