10AX115R3F40E2SG vs 10AX090R3F40E2SG Perbandingan
Perbandingan bersamaan detil 10AX115R3F40E2SG dari Intel dan 10AX090R3F40E2SG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AX115R3F40E2SG | 10AX090R3F40E2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | — |
| M20K Memory Blocks | 2,738 | — |
| DSP Blocks | 1,518 (variable-precision, hard FP) | 2,713 (18x19 multipliers) |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | — |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | 20 nm |
| Speed Grade | -2 | -E2 (extended, mid-tier) |
| Temperature Grade | E2 (0C to +100C) | Extended (-40C to +100C) |
| Paket | 1517-ball FCBGA (F40), 1.0 mm pitch | 1517-ball FCBGA, F40 (40x40 mm, 1.0 mm pitch) |
| Tipe Mounting | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 900,000 |
| Adaptive Logic Modules (ALMs) | — | 339,620 |
| Logic Array Blocks (LABs) | — | 339,620 |
| Embedded Memory (Bits) | — | 59,234,304 |
| User I/O | — | 342 |
| Core Voltage | — | 0.85 V |
| Auxiliary Voltage | — | 0.9 V |
| Level MSL | — | 3 (168 hours) |