10AX115R3F40E2SG vs 10AX090R3F40E2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115R3F40E2SG sa pamamagitan ng Intel at 10AX090R3F40E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX115R3F40E2SG | 10AX090R3F40E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | — |
| M20K Memory Blocks | 2,738 | — |
| DSP Blocks | 1,518 (variable-precision, hard FP) | 2,713 (18x19 multipliers) |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | — |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | 20 nm |
| Speed Grade | -2 | -E2 (extended, mid-tier) |
| Temperature Grade | E2 (0C to +100C) | Extended (-40C to +100C) |
| Packhaging | 1517-ball FCBGA (F40), 1.0 mm pitch | 1517-ball FCBGA, F40 (40x40 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 900,000 |
| Adaptive Logic Modules (ALMs) | — | 339,620 |
| Logic Array Blocks (LABs) | — | 339,620 |
| Embedded Memory (Bits) | — | 59,234,304 |
| User I/O | — | 342 |
| Core Voltage | — | 0.85 V |
| Auxiliary Voltage | — | 0.9 V |
| Level ng MSL | — | 3 (168 hours) |