10CL006YU256A7G vs 10CL006ZU256I8G Perbandingan
Perbandingan bersamaan detil 10CL006YU256A7G dari Intel dan 10CL006ZU256I8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10CL006YU256A7G | 10CL006ZU256I8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements (LE) | 6,272 | 6,272 |
| Embedded Memory Bits | 276,480 | 276,480 bits |
| Embedded Memory (M9K blocks) | 30 blocks (270 Kbits) | — |
| Maximum User I/Os | 176 | — |
| PLLs | 2 | — |
| Paket | 256-UBGA (Ultra FineLine BGA) | 256-ball UFBGA (UBGA), 0.8 mm pitch |
| Suhu Kerja | -40C to +125C (Automotive / Industrial grade 'A7G' suffix) | -40 C to +100 C (Industrial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | TSMC 60 nm low-power | 60 nm low-power CMOS |
| Supply Voltage - Core | 1.2 V (typical) | 1.0 V / 1.2 V (VCCINT) |
| Supply Voltage - I/O | 1.2 V to 3.3 V (multi-voltage I/O banks) | 1.2 V to 3.3 V (VCCIO, per bank) |
| Configuration Memory | SRAM-based (volatile, requires configuration device or JTAG) | — |
| Level MSL | 3 (per JEDEC J-STD-020, BGA handling) | — |
| Status RoHS | Compliant | Compliant |
| Embedded Memory Blocks | — | 30 M9K blocks (270 Kbits) |
| 18 x 18 Embedded Multipliers | — | 15 |
| General-Purpose PLLs | — | 4 |
| Maximum User I/O Pins | — | 176 |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |