10CL006YU256A7G vs 10CL006ZU256I8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10CL006YU256A7G sa pamamagitan ng Intel at 10CL006ZU256I8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10CL006YU256A7G | 10CL006ZU256I8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements (LE) | 6,272 | 6,272 |
| Embedded Memory Bits | 276,480 | 276,480 bits |
| Embedded Memory (M9K blocks) | 30 blocks (270 Kbits) | — |
| Maximum User I/Os | 176 | — |
| PLLs | 2 | — |
| Packhaging | 256-UBGA (Ultra FineLine BGA) | 256-ball UFBGA (UBGA), 0.8 mm pitch |
| Temperature na Operasyon | -40C to +125C (Automotive / Industrial grade 'A7G' suffix) | -40 C to +100 C (Industrial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | TSMC 60 nm low-power | 60 nm low-power CMOS |
| Supply Voltage - Core | 1.2 V (typical) | 1.0 V / 1.2 V (VCCINT) |
| Supply Voltage - I/O | 1.2 V to 3.3 V (multi-voltage I/O banks) | 1.2 V to 3.3 V (VCCIO, per bank) |
| Configuration Memory | SRAM-based (volatile, requires configuration device or JTAG) | — |
| Level ng MSL | 3 (per JEDEC J-STD-020, BGA handling) | — |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory Blocks | — | 30 M9K blocks (270 Kbits) |
| 18 x 18 Embedded Multipliers | — | 15 |
| General-Purpose PLLs | — | 4 |
| Maximum User I/O Pins | — | 176 |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |