10CL006YU256A7G vs 10CL006ZU256I8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10CL006YU256A7G disebabkan oleh Intel dan 10CL006ZU256I8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10CL006YU256A7G | 10CL006ZU256I8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements (LE) | 6,272 | 6,272 |
| Embedded Memory Bits | 276,480 | 276,480 bits |
| Embedded Memory (M9K blocks) | 30 blocks (270 Kbits) | — |
| Maximum User I/Os | 176 | — |
| PLLs | 2 | — |
| Kemasan | 256-UBGA (Ultra FineLine BGA) | 256-ball UFBGA (UBGA), 0.8 mm pitch |
| Suhu Operasi | -40C to +125C (Automotive / Industrial grade 'A7G' suffix) | -40 C to +100 C (Industrial) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | TSMC 60 nm low-power | 60 nm low-power CMOS |
| Supply Voltage - Core | 1.2 V (typical) | 1.0 V / 1.2 V (VCCINT) |
| Supply Voltage - I/O | 1.2 V to 3.3 V (multi-voltage I/O banks) | 1.2 V to 3.3 V (VCCIO, per bank) |
| Configuration Memory | SRAM-based (volatile, requires configuration device or JTAG) | — |
| Aras MSL | 3 (per JEDEC J-STD-020, BGA handling) | — |
| Status RoHS | Compliant | Compliant |
| Embedded Memory Blocks | — | 30 M9K blocks (270 Kbits) |
| 18 x 18 Embedded Multipliers | — | 15 |
| General-Purpose PLLs | — | 4 |
| Maximum User I/O Pins | — | 176 |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |