10M04DAF256C7G vs 10M25DAF256C8G Perbandingan
Perbandingan bersamaan detil 10M04DAF256C7G dari Intel dan 10M25DAF256C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M04DAF256C7G | 10M25DAF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 4,000 | 25,000 |
| Maximum User I/Os | 178 | — |
| Embedded Memory (M9K blocks total) | 176 Kbits | — |
| User Flash Memory | 193,536 bits | — |
| Configuration Flash (on-die) | 1,178 Kbits (CFM0 + CFM1 dual-config) | — |
| Paket | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Temperature Grade (junction) | 0C to 100C (commercial) | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| Auxiliary Voltage | 2.5 V / 3.3 V | — |
| ADC | 1 x 12-bit, 1 Msps SAR | — |
| PLL | 1 (general-purpose) | — |
| Process Technology | 55 nm TSMC flash-based | — |
| LVDS Transmitter (max data rate) | 800 Mbps | — |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Lead-Free | Yes | — |
| Embedded Memory | — | 1,728 Kbits |
| Embedded 18x18 Multipliers | — | 55 |
| User I/O Count | — | 178 |
| PLLs | — | 4 |
| Hard ADC Blocks | — | 2 (12-bit) |
| Configuration Flash | — | Internal, non-volatile |
| Process Node | — | 55 nm TSMC |
| Speed Grade | — | C8 |
| Temperature Grade | — | Commercial (0 °C to 85 °C) |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Lead-Free / Halogen-Free | — | Yes / Yes |