10M16DAU324C8G vs 10M16DAU324I7P Perbandingan
Perbandingan bersamaan detil 10M16DAU324C8G dari Intel dan 10M16DAU324I7P dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M16DAU324C8G | 10M16DAU324I7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 16,000 | — |
| Embedded Memory Bits | 562,176 | — |
| User Flash Memory (UFM) | [DATA_NEEDED: UFM size in Kb] | — |
| Maximum User I/O | 246 | — |
| Paket | 324-UBGA (Ultra FineLine BGA) | 324-LFBGA (UBGA-324) |
| Core Supply Voltage | 1.2 V (on-chip regulator) | — |
| Process Technology | TSMC 55 nm CMOS (non-volatile) | — |
| Configuration Memory | Internal flash, dual-boot capable | — |
| Embedded ADC | 12-bit SAR ADC | — |
| Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| LVDS Performance | Up to 1.6 Gbps per pair | — |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) | — |
| Suhu Kerja | Commercial (0C to +85C) - speed grade 8 | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | 3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Logic Elements | — | 16000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| User I/O Count | — | 246 |
| Embedded Memory | — | 549 kbit |
| Embedded Multipliers (18x18) | — | 246 |
| User Flash Memory | — | [DATA_NEEDED: user flash size] |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +100 C |
| Speed Grade | — | 7 |
| Temperature Grade | — | Industrial (I) |