10M50DAF484C7G vs 10M50DAF484I7P Perbandingan
Perbandingan bersamaan detil 10M50DAF484C7G dari Intel dan 10M50DAF484I7P dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DAF484C7G | 10M50DAF484I7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | FPGA (Field-Programmable Gate Array) | — |
| Series | MAX 10 | — |
| Logic Elements | 50,000 | — |
| Embedded Memory | 1,677,312 bits (approximately 1.6 Mbit) | — |
| Embedded 18x18 Multipliers | 312 | — |
| User Flash Memory | [DATA_NEEDED: user flash bits] | — |
| Number of User I/O | 360 | — |
| Tegangan Pemuat | 1.2 V core (VCCINT) | — |
| Paket | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-ball FineLine BGA (F484) |
| Tipe Mounting | Surface Mount | — |
| Configuration Memory | Non-volatile embedded flash (dual-configuration) | — |
| PLLs | 2 | 8 (general-purpose, fractional on selected devices) |
| Global Clock Networks | [DATA_NEEDED: global clocks count] | 20 |
| ADC | Integrated 12-bit SAR, up to 17 channels | — |
| Suhu Kerja | 0 C to +85 C (commercial grade, C7 speed) | -40C to +100C (Tj, industrial) |
| Process Technology | 55 nm embedded flash CMOS | — |
| Level MSL | 3 | — |
| Status RoHS | Compliant | Compliant |
| Product Family | — | MAX 10 |
| Logic Elements (LE) | — | 50,000 |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded Memory Blocks | — | M9K (and M144K) |
| 18x18 Multipliers | — | 312 |
| User I/O Pins (max) | — | 360 |
| Pitch | — | 1.0 mm |
| Process Node | — | 55 nm embedded flash (TSMC) |
| On-die Configuration Flash | — | Yes (non-volatile, instant-on) |
| On-die ADC | — | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs |
| Speed Grade | — | 7 (slowest industrial bin, highest margin) |
| Configuration Modes | — | Internal flash, JTAG, dual-boot image support |