5CSEBA6U23C8SN vs 5CSEBA6U23I7LN Perbandingan
Perbandingan bersamaan detil 5CSEBA6U23C8SN dari Intel dan 5CSEBA6U23I7LN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 5CSEBA6U23C8SN | 5CSEBA6U23I7LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Designator | 5CSEBA6 (U23 speed grade, 8 speed) | — |
| Logic Elements | 110,000 | 110,000 |
| HPS Processor | Single ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 600 MHz | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| DSP Blocks | 224 (18x18 multipliers) | [DATA_NEEDED: variable-precision DSP block count] |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) | — |
| Hard Memory Controller | DDR2/DDR3 with ECC (HPS) | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, NAND, SD/MMC, I2C, SPI, UART | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART, SD/SDIO |
| Maximum User I/O | [DATA_NEEDED: user I/O count for U23 package] | — |
| LVDS Channels | Up to 17 (875 Mbps) | — |
| Process Technology | TSMC 28 nm low-power | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature grade] | — |
| Paket | 672-ball UBGA (23x23 mm) | 672-pin UBGA (UBG-672) 23x23 mm |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant | Compliant (lead-free suffix) |
| Lead-Free | Yes | — |
| Processor Cores | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Clock | — | 925 MHz |
| Speed Grade | — | I7 (fast) |
| Temperature Range | — | Industrial (-40C to +100C junction) |
| Suffix L | — | Lead-free |
| Suffix N | — | Tray packaging |
| Hard Memory Blocks | — | [DATA_NEEDED: total M10K and MLAB bits] |
| Configuration Mode | — | JTAG and Active Serial (AS) |
| Process Node | — | TSMC 28 nm low-power |
| Design Toolchain | — | Intel Quartus Prime + SoC EDS |