5CSEBA6U23C8SN vs 5CSEBA6U23I7LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA6U23C8SN sa pamamagitan ng Intel at 5CSEBA6U23I7LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSEBA6U23C8SN - Cyclone V SE SoC FPGA, 110K LE, ARM Cortex-A9 | Intel
5CSEBA6U23C8SN ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSEBA6U23C8SN | 5CSEBA6U23I7LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Designator | 5CSEBA6 (U23 speed grade, 8 speed) | — |
| Logic Elements | 110,000 | 110,000 |
| HPS Processor | Single ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 600 MHz | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| DSP Blocks | 224 (18x18 multipliers) | [DATA_NEEDED: variable-precision DSP block count] |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) | — |
| Hard Memory Controller | DDR2/DDR3 with ECC (HPS) | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, NAND, SD/MMC, I2C, SPI, UART | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART, SD/SDIO |
| Maximum User I/O | [DATA_NEEDED: user I/O count for U23 package] | — |
| LVDS Channels | Up to 17 (875 Mbps) | — |
| Process Technology | TSMC 28 nm low-power | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature grade] | — |
| Packhaging | 672-ball UBGA (23x23 mm) | 672-pin UBGA (UBG-672) 23x23 mm |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Compliant | Compliant (lead-free suffix) |
| Lead-Free | Yes | — |
| Processor Cores | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Clock | — | 925 MHz |
| Speed Grade | — | I7 (fast) |
| Temperature Range | — | Industrial (-40C to +100C junction) |
| Suffix L | — | Lead-free |
| Suffix N | — | Tray packaging |
| Hard Memory Blocks | — | [DATA_NEEDED: total M10K and MLAB bits] |
| Configuration Mode | — | JTAG and Active Serial (AS) |
| Process Node | — | TSMC 28 nm low-power |
| Design Toolchain | — | Intel Quartus Prime + SoC EDS |