5M2210ZF256I5N vs 5M2210ZF256I5 Perbandingan
Perbandingan bersamaan detil 5M2210ZF256I5N dari Intel dan 5M2210ZF256I5 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 5M2210ZF256I5N | 5M2210ZF256I5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | MAX V | — |
| Device Logic Elements | 1700 | — |
| Maximum User I/O Pins | 212 | — |
| Pin-to-Pin Logic Delay (tPD) | 7 ns | — |
| Maximum Operating Frequency | [DATA_NEEDED: fMAX] | — |
| User Flash Memory | 8 Kbits | — |
| Paket | 256-ball FBGA | FBGA-256 (256-ball FineLine BGA) |
| Package Designator | ZF256 | — |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Process Technology | 0.18 um embedded-flash CMOS | — |
| Supply Voltage - Core | 1.8 V nominal | — |
| I/O Bank Supply (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Configuration Memory | Internal non-volatile flash (instant-on) | Non-volatile flash |
| Boundary Scan | IEEE Std 1149.1 (JTAG) | — |
| Programming Interface | JTAG / ISP via Quartus II or Quartus Prime | JTAG (IEEE 1149.1) / in-system |
| Status RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Lead-free; halogen-free status [DATA_NEEDED] | — |
| Level MSL | MSL3 (per JEDEC J-STD-020, reflow at 260C) | — |
| Family | — | MAX V |
| Device | — | 5M2210Z |
| Logic Elements (Macro Cells) | — | 1700 |
| Maximum Internal Frequency (fMAX) | — | 201.1 MHz |
| Core Supply Voltage | — | 1.8 V |
| User I/O (max, package-dependent) | — | 212 |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40C to +100C |
| I/O Bank Voltages Supported | — | 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Tipe Mounting | — | Surface Mount |
| Tray Standard Quantity | — | 119 |